Wafer Abrading Machine Tender
Overall rating: (N/A)
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Tends abrading machines that roughen surface of semiconductor
wafers to distinguish front from back: Adjusts controls to set
speed, time, and pressure of abrading belts according to
specifications.
Loads container of wafers into abrading mcahine
and starts machine that automatically abrades surface of wafer.
Remvoes abraded wafers from machine and inspects wafers to
detect abrading defects, such as cracks, using microscope.
Replaces worn abrading belts.
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Wafer Abrading Machine Tender
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